Electronic equipment enclosure and electronic equipment having the enclosure
AssigneeSony Corporation
InventorShunsuke Ikeo
Life of this patent
Estimating the term…
Abstract
Electronic equipment enclosure and electronic equipment having the enclosure are provided: the enclosure covers at least part of an electronic equipment main body. The enclosure includes a flat metal plate layer die cast on an inner surface; and a flat resin plate layer molded on an outer surface to almost entirely cover an outer surface of the metal plate layer. Further, the enclosure includes a two-layer structure of the metal plate layer and the resin plate layer.
Claims8
An enclosure to cover at least part of an electronic equipment main body, the enclosure comprising:
- a flat metal plate layer die cast on an inner surface;
- and
- a flat resin plate layer molded on an outer surface to almost entirely cover an outer surface of the metal plate layer, the enclosure formed to have a two-layer structure of the metal plate layer and the resin plate layer.
Electronic equipment having an electronic equipment main body at least partially covered with an enclosure, the enclosure comprising:
- a flat metal plate layer die cast on an inner surface;
- and a flat resin plate layer molded on an outer surface to almost entirely cover an outer surface of the metal plate layer, the enclosure formed to have a two-layer structure of the metal plate layer and the resin plate layer.
Dependencies are inferred from the claim text.