Unique cooling scheme for advanced thermal management of high flux electronics

A method for cooling an electronics package, the method comprising:

• pumping fluid from a fluid pump through a package conduit to an input manifold disposed at the electronics package;
• distributing the fluid from the input manifold through a plurality of input manifold arms to an array of cooling channels disposed in one or more cooling layers interspersed with one or more electronics layers in the electronics package;
• absorbing heat in the electronics package by forcing the fluid through the array of cooling channels formed in a substrate of each cooling layer;
• collecting the fluid from the array of cooling channels in a plurality of output manifold arms interspersed with the input manifold arms and further collecting the fluid into an output manifold;
• urging the fluid through a cooler conduit to a heatsink portion of a microcooler assembly comprising a turbomachine and the heatsink;
• absorbing heat from the fluid into the heatsink;
• radiating the heat from the heatsink to ambient air by utilizing the turbomachine to force a volume of air across the heat sink;
• and
• returning the fluid from the heatsink to the fluid pump through a pump conduit.