Heat dissipation device with a heat pipe

A heat dissipation device comprising:

• a base having a bottom face adapted for contacting with a heat-generating electronic component;
• a heat pipe comprising an evaporating portion embedded in the base and two condensing portions extending from opposite ends of the evaporating portions;
• and
• two heat spreaders respectively receiving the condensing portions of the heat pipe;
• a first and second fin assemblies each having two contacting faces, the heat spreaders receiving condensing portions of the heat pipe being sandwiched by the first and second fin assemblies between the contacting faces, an opening enclosed by the first and second fin assemblies and the heat spreaders.

A heat dissipation device comprising:

• a base thermally connecting with a graphics processing unit of a graphics card;
• a heat radiator mounted on the base and having a first arc-shaped fin assembly and a second arc-shaped fin assembly connecting with the first arc-shaped fin assembly to define a round opening therebetween;
• an electric fan received in the round opening for generating a forced airflow through channels between fins of the first and second fin assemblies, wherein the fins are oriented substantially parallel to an orientation of the base;
• and
• at least a heat pipe having an evaporating portion thermally connecting with the base and a condensing portion located between confronting ends of the first and second fin assemblies and thermally connecting therewith.