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US 2008/0156457 A1Published application
Thermally coupling an integrated heat spreader to a heat sink base
OwnerMatthew J. Schaenzer, Thomas J. Fitzgerald +3inventors
InventorsMatthew J. Schaenzer, Thomas J. Fitzgerald, Tim A. Renfro, Manjit Dhindsa, Vaibhav P. Trivedi
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Abstract
The base of a heat sink may be selectively plated with a solder wetting material and soldered to an integral heat spreader also selectively plated with gold. In another embodiment, the solder may be applied in the form of an insert made up of an electrical heating wire sandwiched between indium foil which acts as solder when heated by the intervening wire.
Claims8
a heat sink comprising:
- a heat transfer surface;
- a base having a first and second side, the heat transfer surface coupled to a first side of said base;
- and
- a selectively plated solder wetting material on the second side of said base.
1 more element
An integral heat spreader comprising:
- a body to receive an integrated circuit, said body including an external surface exposed when said body receives said circuit;
- and
- a solder wetting layer on said body, said layer covering less than all of said external surface.
Dependencies are inferred from the claim text.