Method for Connecting Flexible Printed Circuit Board to Another Circuit Board
OwnerKohichiro Kawate, Yoshiaki Sato +1inventors
InventorsKohichiro Kawate, Yoshiaki Sato, Yuji Hirasawa
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OwnerKohichiro Kawate, Yoshiaki Sato +1inventors
InventorsKohichiro Kawate, Yoshiaki Sato, Yuji Hirasawa
Estimating the term…
A method for connecting FPC to a second circuit board, comprising the steps of (i) preparing a flexible printed circuit board (FPC) and a second circuit board, (ii) disposing the connection parts of the FPC to face the connection parts of the second circuit board such that a thermosetting adhesive film is present between the connection parts of the FPC and the connection parts of the second circuit board, and (iii) applying heat and pressure sufficiently high to thoroughly push away the adhesive film for establishing electrical contact and allow for curing of the adhesive, wherein the ratio of conductor width (L)/conductor-to-conductor distance (S) in the conductor wiring end parts constituting the connection parts of FPC is 0.5 or less and the thermosetting adhesive film is adjusted to have a viscosity of 500 to 20,000 Pa·s at 200° C.
A method for connecting a flexible printed circuit board (FPC) to a second circuit board, comprising the steps of:
Dependencies are inferred from the claim text.