US 2008/0156434 A1 · DOUBLE-SIDED MOUNTING APPARATUS AND ELECTRIC DEVICE MANUFACTURING METHOD

Abstract

A double-sided mounting apparatus includes a first pressure bonding tool and a second pressure bonding tool disposed opposite to each other, heating mechanism for heating the first pressure bonding tool and the second pressure bonding tool, pressing mechanism for applying pressure to an area between the first pressure bonding tool and the second pressure bonding tool, a work holding mechanism which holds a work item between the first and second pressure bonding tools, a first protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a first protective tape to the first pressure bonding tool, and a second protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a second protective tape to the second pressure bonding tool.

Claims13

Dependent claims

A double-sided mounting apparatus, comprising:

a first pressure bonding tool and a second pressure bonding tool disposed opposite to each other;
heating means for heating the first pressure bonding tool and the second pressure bonding tool;
pressing means for applying pressure to an area between the first pressure bonding tool and the second pressure bonding tool;
a work holding mechanism which holds a work item between the first and second pressure bonding tools;
a first protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a first protective tape to the first pressure bonding tool;
and
a second protective tape supply mechanism disposed between the first and second pressure bonding tools and used to supply a second protective tape to the second pressure bonding tool.

4 more elements

An electric device manufacturing method comprising:

a step of temporarily fastening a first electronic component to a surface of a mounting base via a first anisotropic conductive adhesive, and temporarily fastening a second electronic component to the back of the mounting base, which is opposite to the surface, via a second anisotropic conductive adhesive;
a step of disposing a first protective tape opposite to the first electronic component temporarily fastened, and disposing a second protective tape opposite to the second electronic component temporarily fastened;
and
a step of applying heat and pressure to the first anisotropic conductive adhesive via the first protective tape and the first electronic component, and applying heat and pressure to the second anisotropic conductive adhesive via the second protective tape and the second electronic component, thereby connecting the first and second electronic components to the surface and back, respectively, of the mounting base.

1 more element

Dependencies are inferred from the claim text.

Double-sided mounting apparatus and electric device manufacturing method

Life of this patent

Double-sided mounting apparatus and electric device manufacturing method

Life of this patent

Abstract

Claims13