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US 2008/0156428 A1Published application
Process For Bonding Substrates With Improved Microwave Absorbing Compositions
AssigneeKimberly-Clark Worldwide, Inc.
InventorsRobert Allen Janssen, Michael Joseph Garvey, Dennis John DeGroot, Earl C. McCraw
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Abstract
The present disclosure provides for methods of using adhesive compositions having improved microwave absorbing properties to bond substrates to form laminated structures. Specifically, the adhesive compositions utilized in the methods of the present disclosure absorb the microwave energy, thereby heating and melting into the substrate materials and bonding the substrates together, providing for an improved laminated structure.
Claims16
A process for bonding substrates to form a laminated structure, the process comprising:
- applying an adhesive composition having a dielectric loss factor at 900 MHz and 22 degrees Celsius of at least about 5 to at least a first face of a first substrate;
- contacting the first substrate with a second substrate to form a laminated structure;
- moving the laminated structure through a microwave application chamber of a microwave system;
- and
- operating the microwave system to impart microwave energy to the laminated structure in the microwave application chamber to facilitate bonding of the laminated structure.
2 more elements
Dependencies are inferred from the claim text.