Method and apparatus for cleaning a substrate
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsien-Cheng Wang, Hung Chang Hsieh, Tsiao-Chen Wu, Jian-Hong Chen
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Abstract
A method for photolithography processing includes forming a photoresist layer on a surface of a substrate, baking the substrate to remove solvents from the photoresist layer, cleaning an edge of the substrate with a tape, and exposing the photoresist layer with radiation energy. The tape includes a cleaning material. The tape is positioned proximate to or in contact with the edge of the substrate while the substrate is rotating.
Claims20
A method, comprising:
- providing a substrate;
- cleaning an edge of the substrate with a tape;
- and
- processing the substrate;
- wherein the cleaning includes configuring the tape to include a cleaning material, wherein the cleaning includes positioning the tape proximate to or in contact with the edge of the substrate while the substrate is rotating.
The method of claim 9, wherein the processing the substrate includes:
- exposing the photoresist layer with radiation energy in an immersion lithography system;
- baking the exposed photoresist layer;
- and
- developing the exposed photoresist layer.
An apparatus for cleaning an edge of a substrate, comprising:
- a tape having a surface coated with a cleaning material;
- a set of spools, wherein the tape is wound between the set of spools;
- and
- a controller configured and operable to position the edge of the substrate proximate to or in contact with the surface of the tape coated with the cleaning material while the substrate is rotating.
A system for cleaning a substrate, comprising:
- a stage for holding the substrate;
- a cleaning module, wherein the cleaning module comprises:
- a roll of tape having a surface coated with a cleaning material;
- a first spool and a second spool, wherein the roll of tape is wound between the first spool and the second spool;
- and
- a controller configured and operable to position the surface of the tape coated with the cleaning material proximate to or in contact with an edge of the substrate while the stage is rotating the substrate.
Dependencies are inferred from the claim text.