Wafer inspection machine and method

A wafer inspection method using a wafer inspection machine including an inspection stage having a first area for unloading an inspected wafer and loading a new wafer to be inspected and a second area for inspecting a wafer, and a plurality of wafer mounting units installed on the inspection stage to face each other, the method comprising:

• (a) unloading an inspected wafer from the wafer mounting unit located on the first area and loading a new wafer to be inspected in the wafer mounting unit located on the first area;
• (b) moving the wafer mounting unit located on the first area to the second area by rotation;
• (c) inspecting an upper surface of the wafer loaded in the wafer mounting unit moved to the second area by rotation;
• (d) inverting the wafer using a wafer inverting means and inspecting a lower surface of the wafer;
• and
• (e) moving the wafer mounting unit located on the second area to the first area by rotation,
• wherein the step (a) is performed simultaneously with the steps (c) and (d).