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US 2008/0156003 A1Published application
Using refrigeration and heat pipe for electronics cooling applications
AssigneeIntel Corporation
InventorRajiv K. Mongia
Life of this patent
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Abstract
A cooling system includes a heat pipe and a refrigerator. A combination at least one or more of the heat pipe and the refrigerator is used to cool an electronic component capable of generating heat. Depending on the cooling requirement, a different cooling combination may be used.
Claims20
An apparatus comprising:
- a refrigeration system to cool an electronic component in a computer system;
- and
- a heat pipe coupled to the electronic component, to the refrigeration system and to a heat exchanger, wherein the heat pipe is to cool the electronic component, and wherein cooling of the electronic component is performed by at least the heat pipe and the heat exchanger.
A method, comprising:
- cooling a component capable of generating heat using a cooling system that includes refrigeration cooling and heat pipe cooling, wherein when cooling requirement is at a first level, only heat pipe cooling is used.
A system, comprising:
- a processor;
- a heat pipe coupled to the processor to provide heat pipe cooling when the processor is to generate heat;
- and
- a refrigerator coupled to the heat pipe and to the processor to provide refrigeration cooling when the processor is to generate heat, wherein depending on cooling requirement of the processor, a combination of heat pipe cooling and refrigeration cooling is applied.
1 more element
Dependencies are inferred from the claim text.