Socket enabled current delivery to a thermoelectric cooler to cool an in-substrate voltage regulator
AssigneeIntel Corporation
InventorsAshish Gupta, David S. Chau
Life of this patent
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AssigneeIntel Corporation
InventorsAshish Gupta, David S. Chau
Estimating the term…
An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.
An apparatus comprising:
A method comprising:
A system comprising:
Dependencies are inferred from the claim text.