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US 2008/0155903 A1Published application
Composite Polishing Pad
AssigneeRimpad Tech Ltd.
InventorSpencer Preston
Life of this patent
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Abstract
A polishing pad having an optically clear bottom layer and a closed cell top layer where the interface between the top and bottom layers is only a urethane to urethane interface. Grooves may be machined into the top layer or through the top layer and into the bottom layer.
Claims4
A method for making a polishing pad comprising the steps of:
- providing a solid urethane piece having a cavity contained therein wherein said solid urethane piece comprises a first Shore D hardness;
- pouring a liquid urethane formulation into the cavity of the solid urethane piece wherein the liquid urethane formulation comprises a hardness formulation having a second Shore D hardness;
- allowing the liquid urethane formulation to solidify and cure;
- machining the solid urethane piece to a desired thickness;
- and
- machining the solidified liquid urethane formulation to a desired thickness.
3 more elements
Dependencies are inferred from the claim text.