Land grid array (lga) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometries

A method of producing a land grid array (LGA) interposer structure, comprising an electrically insulating carrier plane, mounting at least one interposer on a first surface of said carrier plane, said interposer selectively having a hemi-toroidal, conical, dome-shaped conic section, generally cylindrical or hemi-spherical configuration in transverse cross-section and being constituted of a dielectric elastomeric material;

• a plurality of electrically-conductive elements about the surface of said at least one hemi-toroidal interposer that extend radially inwardly and downwardly from an uppermost end thereof into electrical contact with at least one component located on an opposite side of said electrically insulating carrier plane, mounting said at least one component comprising at least one hemi-toroidal interposer mounted on said opposite side of said carrier plane and which is identical to and in an inverted relationship with said first-mentioned at least one hemi-toroidal interposer, said electrically-insulating carrier plane having at least one through-extending via formed therein, said electrically-conductive elements comprising metallic strips forming electrical connections between said first-mentioned at least one hemi-toroidal interposer and said further at least one inverted hemi-toroidal interposer.