Wiring substrate, manufacturing method thereof, and semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTadashi Arai, Toshio Kobayashi
Life of this patent
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Abstract
In a wiring substrate according to the present invention, a base wiring board is constructed by stacking a plurality of unit wiring boards each having wiring patterns which enable an electrical connection between upper and lower sides, in a state that the plurality of unit wiring boards are connected to each other via a connection terminal, and a silicon interposer is stacked on the base wiring board via a connection terminal, and a resin portion is filled in a gap between the plurality of unit wiring boards as well as a gap between the base wiring board and the silicon interposer, and a resin portion serves as a substrate which integrates the base wiring board and the silicon interposer.
Claims10
A wiring substrate, comprising:
- a base wiring board constructed by stacking a plurality of unit wiring boards each having wiring patterns which enable an electrical connection between upper and lower sides, in a state that the plurality of unit wiring boards are connected to each other via a connection terminal;
- a silicon interposer which is stacked on the base wiring board, and having wiring patterns which enable an electrical connection between upper and lower sides, and connected to the wiring patterns of the base wiring board via a connection terminal;
- and
- a resin portion which is filled in a gap between the plurality of unit wiring boards as well as a gap between the base wiring board and the silicon interposer, and which integrates the base wiring board and the silicon interposer.
A method of manufacturing a wiring substrate, comprising the steps of:
- preparing a base wiring board constructed by stacking a plurality of unit wiring boards each having wiring patterns which enable an electrical connection between upper and lower sides, in a state that the plurality of unit wiring boards are connected to each other via a connection terminal, and obtaining an interposer-attached wiring substrate by connecting the silicon interposer to the wiring patterns of the base wiring board via a connection terminal;
- and
- forming a resin portion which integrates the base wiring board and the silicon interposer, by disposing a mold die on the interposer-attached wiring substrate, then, filling a resin in a gap between the plurality of unit wiring boards as well as a gap between the base wiring board and the silicon interposer by means of vacuum transfer molding.
Dependencies are inferred from the claim text.