Circuit board and method for manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorChien Hao Wang
Life of this patent
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Abstract
A method for manufacturing a circuit board includes the steps of: forming a first wiring layer on a substrate; forming an insulating layer on the surface of the first wiring layer by means of electrophoretic deposition; forming a second wiring layer on the insulating layer and the surface of the substrate; and performing the follow-up procedures, such as forming a solder mask; thereby reducing the thickness of the circuit board and increasing the density of the circuit layout.
Claims21
A method for manufacturing a circuit board, comprising:
- forming a first wiring layer on a substrate;
- forming an insulating layer on the surface of the first wiring layer by means of electrophoretic deposition;
- and
- forming a second wiring layer on the insulating layer and the surface of the substrate.
A method for manufacturing a circuit board, comprising:
- providing a substrate;
- forming a first wiring layer respectively on the front and back sides of the substrate;
- forming an insulating layer on the surface of the first wiring layer by means of electrophoretic deposition;
- forming a second wiring layer on the insulating layer and the substrate;
- forming a solder mask layer on the second wiring layer;
- and
- performing a photolithography process to expose portion of the second wiring layer to form a plurality of contacts.
A circuit board, comprising:
- a substrate;
- a first wiring layer formed on a surface of the substrate;
- an electrophoretic deposited insulating layer formed on the surface of the first wiring layer;
- a second wiring layer formed on the electrophoretic deposited insulating layer and the substrate;
- and
- a dielectric layer formed on the second wiring layer and having a plurality of openings to expose portion of the second wiring layer to form a plurality of contacts.
Dependencies are inferred from the claim text.