Patterning method, method of manufacturing organic field effect transistor, and method of manufacturing flexible printed circuit board
AssigneeSony Corporation
InventorAkihiro Nomoto
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Abstract
In the condition where a nozzle for applying a coating liquid is disposed on the lower side of a substrate and a substrate surface controlled in wettability is faced down, the nozzle and the substrate are moved relative to each other, whereby the coating liquid is applied to a desired region of the substrate, and then the coating liquid is dried, to obtain a pattern included a dried coating layer.
Claims1
A method of manufacturing a flexible printed circuit board, wherein a nozzle for applying a conductive material coating liquid and a substrate are moved relative to each other where said nozzle is disposed on a lower side of said substrate and a substrate surface controlled in wettability is faced down, so as thereby to apply said conductive material coating liquid to said substrate, and thereafter said conductive material coating liquid is dried so as thereby to obtain a circuit pattern including a conductive material coating layer.
Dependencies are inferred from the claim text.