Back to results
US 2008/0115880 A1Published application
Manufacturing process of the combining of optical lens and sensor chips
AssigneeEther Precision, Inc.
InventorChao-chi Chang
Life of this patent
Estimating the term…
Abstract
A manufacturing process of the combining of optical lens and senor chips includes the steps of: preparation of a wafer with a plurality of image sensor chips thereon, connection of a plurality of optical lens assemblies to the wafer, wherein each of the optical lens assemblies is associated with the image sensor chip respectively, and division of the wafer to have a plurality of image catch units.
Claims9
A manufacturing process of the combining of optical lens and senor chips, comprising the steps of:
- preparing a wafer with a plurality of image sensor chips thereon;
- connecting a plurality of optical lens assemblies to the wafer, wherein each of the optical lens assemblies is associated with the image sensor chips respectively;
- dividing the wafer to have a plurality of image catch units, wherein each of the image catch units includes one image sensor chip and one optical lens assembly.
A manufacturing process of the combining of optical lens and senor chips, comprising the steps of:
- preparing a wafer with a plurality of image sensor chips thereon;
- connecting an array with a plurality of optical lens assemblies to the wafer, wherein each of the optical lens assemblies of the array is associated with the image sensor chips of the wafer respectively;
- dividing the wafer and the array to have a plurality of image catch units, wherein each of the image catch units includes one image sensor chip and one optical lens assembly.
Dependencies are inferred from the claim text.