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US 2008/0111210 A1Published application
Antifuse structure having an integrated heating element
AssigneeInternational Business Machines Corporation
InventorsByeongju Park, Subramanian Iyer, Chandrasekharan Kothandaraman
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Abstract
The present invention provides antifuse structures having an integrated heating element and methods of programming the same, the antifuse structures comprising first and second conductors and a dielectric layer formed between the conductors, where one or both of the conductors functions as both a conventional antifuse conductor and as a heating element for directly heating the antifuse dielectric layer during programming.
Claims8
A programmable circuit, comprising:
- a semiconductor substrate;
- and
- an antifuse formed on said semiconductor substrate,
- said antifuse comprising:
- a first conductor adapted to receive a first voltage potential V1;
- a dielectric layer formed adjacent said first conductor;
- and
- a second conductor formed adjacent said dielectric layer and separated from said first conductor by said dielectric layer, said second conductor adapted to receive a second voltage potential V2 and a third voltage potential V3 and to heat the dielectric layer in response to V2 and V3.
5 more elements
Dependencies are inferred from the claim text.