Adhesive tape cutting method and apparatus using the same
AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Masaru Irie
Life of this patent
Estimating the term…
Abstract
A strip-shaped supporting adhesive tape is joined to a ring frame, and then is stuck with a cutter blade such that the cutter blade penetrates the adhesive tape. In a state where a cutting edge of the cutter blade is brought into contact with a tape joined side of the ring frame, thereafter, the adhesive tape is cut along a contour of the ring frame while electric current is fed to each of the cutter blade and the ring frame. Herein, a sensor monitors a conduction status in real time.
Claims9
A method for cutting a supporting adhesive tape allowing a ring frame to hold a semiconductor wafer, the method comprising the steps of:
- feeding electric current to a ring frame made of an electrically conductive material and a cutting member;
- allowing the cutting member to penetrate an adhesive tape joined to the ring frame;
- and
- cutting the adhesive tape along a contour of the ring frame while establishing electrical conduction by a contact of a tip end of the cutting member with the ring frame.
An apparatus for cutting a supporting adhesive tape allowing a ring frame to hold a semiconductor wafer, the apparatus comprising:
- frame holding means for holding a ring frame;
- tape supply means for supplying a strip-shaped supporting adhesive tape toward the ring frame;
- joining means for pressing a joining member against a non-adhesive surface of the adhesive tape, allowing the holding means and the joining member to move relatively, and joining the adhesive tape to the ring frame;
- a cutting mechanism including a cutting member having a sharp tip end, and cutting the adhesive tape along a contour of the ring frame while bringing the cutting member penetrating the adhesive tape into contact with the ring frame;
- electric current feed means for feeding electric current to the ring frame and the cutting member upon cutting of the adhesive tape so as to establish electrical conduction;
- detection means for detecting a conduction failure upon cutting of the adhesive tape;
- and
- separation means for separating an unnecessary portion of the cut adhesive tape.
Dependencies are inferred from the claim text.