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US 2008/0077195 A1Published application
Package for an Implantable Device
AssigneeSecond Sight Medical Products, Inc.
InventorsRobert Greenberg, Joseph Schulman
Life of this patent
Estimating the term…
Abstract
The present invention is an implantable electronic device formed within a biocompatible hermetic package. Preferably the implantable electronic device is used for a visual prosthesis for the restoration of sight in patients with lost or degraded visual function. The package may include a hard hermetic box, a thin film hermetic coating, or both.
Claims22
An implantable device, comprising:
- an electrically non-conductive substrate;
- a plurality of electrically conductive vias through said electrically non-conductive substrate;
- a flip-chip circuit attached to said electrically non-conductive substrate using conductive bumps and electrically connected to a said plurality of electrically conductive vias;
- and
- a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
2 more elements
A method of making an implantable device, comprising:
- providing a ceramic containing non-conductive substrate defining a plurality of electrically conductive vias;
- brazing a metallic ring to said ceramic containing non-conductive substrate;
- electrically connecting a circuit to said electrically conductive vias by flip-chip attach;
- and
- welding a metallic top to said metallic ring.
2 more elements
An implantable device, comprising:
- an substantially planar electrically non-conductive substrate;
- a plurality of electrically conductive vias through said electrically non-conductive substrate forming electrodes;
- a circuit attached to said electrically non-conductive substrate and electrically connected to said plurality of electrically conductive vias;
- and
- a cover bonded to said electrically non-conductive substrate, said cover, said electrically non-conductive substrate and said electrically conductive vias forming a hermetic package.
2 more elements
Dependencies are inferred from the claim text.