Heat-curable silicone composition and light emitting diode element using same

Abstract

The present invention provides a heat-curable silicone resin composition that yields a cured product with excellent transparency and minimal discoloration over time, which is ideal as a protective material or lens material or the like for a light emitting diode element. The present invention provides a heat-curable silicone composition, comprising: (A) an organopolysiloxane having at least one structure represented by a general formula shown below within each molecule: (wherein, m represents an integer of 0, 1 or 2, R1 represents a hydrogen atom, phenyl group or halogenated phenyl group, R2 represents a hydrogen atom or methyl group, R3 represents a monovalent organic group of 1 to 10 carbon atoms, Z1 represents a bivalent group represented by —R4—, —R4O— or —R4(CH3)2SiO— (wherein, R4 represents a bivalent organic group of 1 to 10 carbon atoms), and Z2 represents an oxygen atom or a bivalent organic group of 1 to 10 carbon atoms), and (B) a quantity of an organic peroxide that is effective as a curing catalyst.

Dependencies are inferred from the claim text.