Submersible accessory connector
AssigneeMotorola, Inc.
InventorsPeter B. Gilmore, Donald F. Gatto, Weng Kong Hor, Bharathi Ranjit Singh, William R. Williams
Life of this patent
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Abstract
An accessory connector (102) and a method (200) for providing a robust submersible seal is provided. The method can include over molding (202) a high-temperature plastic (122) around a plurality of interconnect pins (112) to produce a header (120), over molding (204) a low-temperature plastic (132) to the header to produce an insert (130), over molding (206) a side connector assembly (142) along a periphery of the insert to produce an interface (140), and ultrasonically welding (212) the insert to a housing (151) to blend (153) the low-temperature plastic with the housing.
Claims20
An accessory connector to a device, that is water-resistant and submersible, comprising:
- a plurality of interconnect pins;
- a high-temperature plastic that is over molded around the plurality of interconnect pins to produce a header, wherein the header withstands interconnect pin dislocations due to high temperature soldering of the interconnect pins and provides a first water seal;
- and
- a low temperature plastic that is over molded around the header to produce an insert, wherein an over molded portion of the low temperature plastic and the high-temperature plastic provides a second water seal.
A mobile device connector, that is water-resistant and submersible, comprising:
- a plurality of interconnect pins;
- a high-temperature plastic that is over molded around the plurality of interconnect pins to produce a header, wherein the header withstands interconnect pin dislocations due to high temperature soldering to provide a first water seal;
- and
- a low temperature plastic that is over molded around the header to produce an insert, wherein an over molded portion of the low temperature plastic and the high-temperature plastic provides a second water seal;
A method for creating an interface, comprising:
- over molding a high-temperature plastic around a plurality of interconnect pins to produce a header, wherein the header withstands interconnect pin dislocations due to high temperature soldering of the interconnect pins to provide a first water seal;
- and
- over molding a low-temperature plastic to the header to produce an insert, wherein an over molded portion of the low temperature plastic and the high-temperature plastic provide a second water seal
- wherein the insert exposes a first end of the plurality of interconnect pins to an exterior of the device, and exposes a second end of the plurality of interconnect pins to an interior of the device.
Dependencies are inferred from the claim text.