US 2008/0076276 A1 · Printed Board And Manufacturing Method Thereof

Abstract

A printed board is able to cool an electronic component with high efficiency without requiring a heatsink for cooling the electronic component while preventing upsizing of the electronic device. A method for manufacturing such a printed board with high efficiency is also disclosed. Since a carbon layer principally made of carbon and having excellent heat conductivity is provided inside an insulator or on a surface of the insulator in a laminated form, heat generated by the electronic component when the electronic component is energized is conducted to the carbon layer, diffused through the carbon layer, and then radiated to the outside. Therefore, the heat generated by the electronic component can be reliably radiated by heat conduction to the carbon layer and heat diffusion through the carbon layer, thereby cooling the electric component with high efficiency.

Claims38

Dependent claims

(canceled)

A printed board that includes an insulator made of an electrical insulating material and a wiring pattern formed on at least one surface of the insulator or on at least one surface of the insulator and inside the insulator and on which one or more electronic components are to be mounted, the printed board comprising:

a sheet-shaped carbon layer principally made of carbon and obtained by rolling,
wherein the carbon layer is provided at least inside the insulator in a laminated form, and
wherein the carbon layer provided inside the insulator in a laminated form is obtained by previously covering both surfaces of a sheet-shaped carbon layer obtained by rolling with a covering layer made of the electrical insulating material and then interposing the carbon layer covered with the covering layer between the electrical insulating materials and crimping the carbon layer and the electrical insulating material.

A method for manufacturing a printed board including a board-shaped insulator made of an electrical insulating material, a wiring pattern layer provided on at least one surface of the insulator or wiring pattern layers provided on at least one surface of the insulator and inside the insulator, a conduction hole for electrically coupling the wiring pattern layers provided so as to be insulated from each other by interposition of the insulator, and at least one layer of board-shaped carbon-containing member principally made of carbon and provided in a laminated form separately from the wiring pattern layer by interposing the insulator, the method comprising:

a covered carbon-containing material forming step of forming a covered carbon-containing member whose both surfaces are covered with an electrical insulating material included in the insulator by crimping the electrical insulating material included in the insulator on both surfaces of the board-shaped carbon-containing member;
a covered carbon-containing member hole making step of making a hole having a circumference larger than a circumference of the conduction hole at a position corresponding to the conduction hole of a covered carbon-containing member obtained in the covered carbon-containing member forming step;
and
a printed board-use laminated board forming step of forming a printed board-use laminated board by interposing an electrical insulating material included in the insulator between the covered carbon-containing member in which a hole having a circumference larger than a circumference of the conduction hole is made in the covered carbon-containing member hole making step, and the wiring pattern layer or a conductor layer for forming a wiring pattern, and then crimping the electrical insulating material, the covered carbon-containing material, and the wiring pattern layer or conductor layer.

1 more element

Dependencies are inferred from the claim text.

Printed Board And Manufacturing Method Thereof

Life of this patent

Printed Board And Manufacturing Method Thereof

Life of this patent

Abstract

Claims38