Adhesive Sheet,Semiconductor Device,and Process for Producing Semiconductor Device
OwnerHiroshi Fukadainventor
Life of this patent
Estimating the term…
Abstract
In the polishing head of a CMP device, the diaphragm which includes an elastic body film is fixed to a carrier plate with the diaphragm stop ring which includes a metallic material. The screw stop of the retaining ring which includes a resin material is done to this diaphragm stop ring with a screw from a lower part. A groove is formed in the under surface of a retaining ring, and the screw hole for doing the screw stop of the retaining ring is formed in the groove. By pressurizing the space sealed by a diaphragm, membrane, etc., a semiconductor wafer is pushed against a polishing pad via membrane, and CMP treatment of the semiconductor wafer is done.
Claims17
A fabrication method of a semiconductor device, comprising a step of:
- doing Chemical Mechanical Polishing of a semiconductor wafer where the semiconductor wafer is held in a wafer holding part with a retaining ring which did a screw stop to the wafer holding part from a lower part, and which includes a resin material;
- wherein a groove is formed in an under surface of the retaining ring, and a retaining ring with which a screw hole deeper than a depth of the groove is formed in the groove portion in order to do a screw stop of the retaining ring is used.
A fabrication method of a semiconductor device, comprising a step of:
- using a grinding apparatus of single wafer processing provided with a plurality of turn tables, a wafer holding part holding a semiconductor wafer moving the turn tables one by one, and performing Chemical Mechanical Polishing processing of a semiconductor wafer where the semiconductor wafer is held in the wafer holding part with a retaining ring which did a screw stop to the wafer holding part from a lower part, which includes a resin material, and with which a groove is formed in an under surface of the resin material, and a screw hole deeper than a depth of the groove is formed in the groove portion in order to do a screw stop of the resin material to the wafer holding part.
A fabrication method of a semiconductor device, comprising a step of:
- doing Chemical Mechanical Polishing of a semiconductor wafer where the semiconductor wafer is held in a wafer holding part with a retaining ring which did a screw stop to the wafer holding part from a lower part, and which includes a resin material;
- wherein a diaphragm is fixed to the wafer holding part by a diaphragm holddown member, and a screw stop of the retaining ring is done to an under surface of the diaphragm holddown member from a lower part.
A fabrication method of a semiconductor device, comprising a step of:
- doing Chemical Mechanical Polishing of a semiconductor wafer where the semiconductor wafer is held in a wafer holding part with a retaining ring which did a screw stop to the wafer holding part from a lower part, and which includes a resin material;
- wherein an elastic membrane is fixed to the wafer holding part by an annular metal member, and a screw stop of the retaining ring is done to an under surface of the metal member from a lower part.
Dependencies are inferred from the claim text.