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US 2008/0076249 A1Published application
Method of manufacturing semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorsTomoharu Fujii, Kiyoshi Oi
Life of this patent
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Abstract
A method for manufacturing a semiconductor device includes: a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure; and a step of bonding the wiring structure to a wiring substrate including electronic components mounted thereon.
Claims9
A method for manufacturing a semiconductor device comprising:
- a step of forming a via plug erected on an electrically conductive layer, and embedding the via plug in an insulation layer to form a wiring structure;
- and
- a step of bonding the wiring structure to a wiring substrate including an electronic component mounted thereon.
A method for manufacturing a semiconductor device comprising:
- a step of forming a via plug erected on an electrically conductive layer to form a via plug structure;
- and
- a step of bonding the via plug structure to a wiring substrate including an electronic component mounted thereon while inserting an insulating layer between the via plug structure and the wiring substrate.
Dependencies are inferred from the claim text.