Method for making an electromechanical component on a plane substrate
AssigneesCommissariat a l'Energie Atomique, STMicroelectronics S.r.l.
InventorsFabrice Casset, Cedric Durand, Pascal Ancey
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AssigneesCommissariat a l'Energie Atomique, STMicroelectronics S.r.l.
InventorsFabrice Casset, Cedric Durand, Pascal Ancey
Estimating the term…
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes. The method comprises at least the following steps in sequence: formation of the substrate comprising one silicon area partly covered by two insulating areas, formation of a sacrificial silicon and germanium alloy layer by selective epitaxy starting from the uncovered part of the silicon area, formation of a strongly doped silicon layer by epitaxy, comprising a monocrystalline area arranged on said sacrificial layer and two polycrystalline areas arranged on insulating areas, simultaneous formation of the vibrating structure and actuation electrodes, by etching of a predetermined pattern in the monocrystalline area designed to form spaces between the electrodes and the vibrating structure, elimination of said sacrificial silicon and germanium alloy layer by selective etching.
Method for making an electromechanical component on a plane substrate and comprising at least one structure vibrating in the plane of the substrate and actuation electrodes, the method comprising at least the following steps in sequence:
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