Manufacturing method of semiconductor device
AssigneeRenesas Electronics Corporation
InventorsHaruhiko Harada, Takao Matsuura
Life of this patent
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Abstract
A thermosetting tape is adopted as a dicing tape and, after package dicing, the thermosetting tape is heated, then a desired one of divided CSPs is picked up by an inverting collet. Since the thermosetting tape is heated o a predetermined temperature so that its adhesive force becomes zero, the CSP can be picked up by the inverting collet without peeling it off from the thermosetting tape. Thus, peel-off charging does not occur and therefore it is not necessary to perform a destaticizing process. As a result, it is possible to improve the production efficiency in assembling the semiconductor device (CSP).
Claims17
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) cutting a matrix substrate with a plurality of semiconductor chips mounted thereover and a resin body formed thereover, in an affixed state of the matrix substrate onto a thermosetting tape, into individual semiconductor devices by a dicing blade;
- (b) after the step (a), heating the thermosetting tape to cure the tape;
- and
- (c) after the step (b), picking up a desired one of the semiconductor devices.
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) providing a matrix substrate having a main surface and a back surface opposed to the main surface, a plurality of device-forming areas being formed over the main surface;
- (b) mounting semiconductor chips over the device-forming areas of the matrix substrate;
- (c) coupling electrodes over the matrix substrate and surface electrodes of the semiconductor chips with each other electrically through metallic wires;
- (d) covering the device-forming areas with one cavity of a resin molding die and sealing the semiconductor chips and the wires with resin;
- (e) providing a plurality of solder balls over the back surface of the matrix substrate;
- (f) cutting the matrix substrate into individual semiconductor devices;
- and
- (g) after the step (f), heating the thermosetting tape to cure the tape and thereafter picking up a desired one of the semiconductor devices.
A method of manufacturing a semiconductor device, comprising the steps of:
- (a) cutting a semiconductor wafer with a first dicing tape affixed thereto into individual semiconductor chips by a dicing blade;
- (b) radiating ultraviolet light to the first dicing tape to cure the tape;
- (c) picking up a desired one of the divided semiconductor chips;
- (d) cutting a matrix substrate with a plurality of semiconductor chips mounted thereover and a resin body formed thereover, in an affixed state of the matrix substrate to a second dicing tape, into individual semiconductor devices by a dicing blade;
- and
- (e) after the step (d), heating the second dicing tape to cure the tape and thereafter picking up a desired one of the semiconductor devices,
- wherein the adhesive force of the second dicing tape at the time of starting the pickup in the step (e) is lower than the adhesive force of the first dicing tape at the time of starting the pickup in the step (c).
Dependencies are inferred from the claim text.