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US 2008/0075918 A1Published application
Wired circuit board and producing method thereof
AssigneeNitto Denko Corporation
InventorsYasunari Ooyabu, Jun Ishii, Kensuke Nishi
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Abstract
A wired circuit board has a metal supporting board, a metal foil formed on the metal supporting board, an insulating base layer formed on the metal supporting board to cover the metal foil, and a conductive pattern formed on the insulating base layer and a having a terminal portion. An opening is formed in the insulating base layer to expose the metal foil.
Claims6
A wired circuit board comprising:
- a metal supporting board;
- a metal foil formed on the metal supporting board;
- an insulating base layer formed on the metal supporting board to cover the metal foil;
- and
- a conductive pattern formed on the insulating base layer and having a terminal portion, wherein
- an opening is formed in the insulating base layer to expose the metal foil.
3 more elements
A method for producing a wired circuit board, the method comprising the steps of:
- preparing a metal supporting board;
- forming a metal foil on the metal supporting board;
- forming an insulating base layer on the metal supporting board to cover the metal foil;
- forming an opening in the insulating base layer to expose the metal foil;
- forming a conductive pattern having a terminal portion on the insulating base layer;
- forming an electrolytic plating layer on a surface of the terminal portion by electrolytic plating;
- and,
- determining whether or not the electrolytic plating layer is formed on a surface of the metal foil exposed from the opening after forming the electrolytic plating layer to inspect conduction between the metal foil and the conductive pattern.
5 more elements
Dependencies are inferred from the claim text.