Apparatus and method incorporating discrete passive components in an electronic package

A method of fabrication comprising:

• a) forming a dielectric insulation layer over a passivation layer of a substrate;
• b) forming a metal layer over the dielectric insulation layer;
• c) forming a layer of photosensitive material over the metal layer;
• d) forming a pattern with the photosensitive material to expose at least one region of the metal layer;
• e) removing the at least one exposed region of the metal layer using the pattern of photosensitive material as a mask, the removal of the at least one exposed region of the metal layer exposing at least one region of the dielectric insulation layer;
• and
• f) removing the remaining photosensitive material from each remaining area of the metal layer to form a structure to which an electronic component may be attached.

A method of forming an electronic device, the method comprising:

• fabricating an integrated circuit on a substrate, forming a passivation layer on an uppermost portion of the integrated circuit;
• fabricating a plurality of attach lands over the passivation layer and electrically isolating the plurality of attach lands from the integrated circuit;
• fabricating a plurality of bond pads over the passivation layer and electrically isolating the plurality of bond pads from the integrated circuit;
• and
• electrically coupling at least one of the plurality of bond pads coupled to at least one of the plurality of attach lands.