Magnetic head structure and method for manufacturing magnetic head structure
AssigneeTDK Corporation
InventorsToru Takahashi, Kiyoshi Kobayashi, Eiji Ozaki
Life of this patent
Estimating the term…
Loading patent…
AssigneeTDK Corporation
InventorsToru Takahashi, Kiyoshi Kobayashi, Eiji Ozaki
Estimating the term…
A magnetic head substrate is provided with a recording element having a main magnetic pole layer and a recording-side monitor element including a resistance film, a lead conductor located as a layer below the resistance film, and a contact conductor for conductively connecting the resistance film and the lead conductor. The resistance film is formed on the same plane as that for a lowermost layer of the main magnetic pole layer or a base layer from the same material as that for them, so as to straddle the surface position of a medium-facing surface in the height direction. The contact conductor and the lead conductor are disposed while being retreated to the back side of the above-described position in the height direction. The upper surface and the lower surface of the contact conductor are entirely in contact with the resistance film and are not exposed to the outside.
A magnetic head structure comprising a recording element having a main magnetic pole layer and a recording-side monitor element to be used as an element resistance monitor in polishing for forming a medium-facing surface of the recording element, the recording-side monitor element including a resistance film, a lead conductor located as a layer below the resistance film, and a contact conductor for conductively connecting the resistance film and the lead conductor,
A method for manufacturing a magnetic head structure provided with a recording element having a main magnetic pole layer and a recording-side monitor element to be used as an element resistance monitor in polishing for forming a medium-facing surface of the recording element, the recording-side monitor element including a resistance film, a lead conductor located as a layer below the resistance film, and a contact conductor for conductively connecting the resistance film and the lead conductor, the method comprising:
Dependencies are inferred from the claim text.