Semiconductor device and method of manufacturing the same
AssigneeMatsushita Electric Industrial Co., Ltd.
InventorsManabu Tanabe, Hiroaki Fujimoto
Life of this patent
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Abstract
In a semiconductor device of the present invention, of wires 5a, 5b and 5c which are vertically arranged to connect a plurality of electrodes 3 formed on a major surface of a semiconductor chip 2 and internal electrodes 4 of conductor portions arranged around the semiconductor chip 2, the wires 5a at the lowest level have the lowest stiffness and the wires 5b and 5c at a higher level have higher stiffness. With this configuration, it is possible to eliminate contact among the wires 5a, 5b and 5c, thereby improving the yields.
Claims20
A semiconductor device in which a plurality of electrodes formed on a major surface of a semiconductor chip and inner terminals of a plurality of conductor portions arranged around the semiconductor chip are electrically connected via thin metal wires and the semiconductor chip and the thin metal wires are sealed with resin, wherein of the plurality of thin metal wires vertically arranged to connect the electrodes of the semiconductor chip and the inner terminals of the conductor portions, the thin metal wires at a lowest level have lowest stiffness.
A method of manufacturing a semiconductor device, comprising:
- a first step of mounting, on a support, a semiconductor chip having a plurality of electrodes formed on a major surface of the semiconductor chip;
- a second step of connecting, via thin metal wires, the plurality of electrodes of the semiconductor chip mounted on the support and inner terminals of a plurality of conductor portions arranged around the semiconductor chip;
- and
- a third step of sealing the semiconductor chip and the thin metal wires with resin,
- wherein in the second step, the electrodes and the inner terminals are connected via the thin metal wires having lowest stiffness at a lowest level out of the plurality of vertically arranged thin metal wires, and then the other electrodes and inner terminals are connected via the thin metal wires having higher stiffness.
Dependencies are inferred from the claim text.