Circuit substrate for preventing warpage and package using the same

A circuit substrate comprising:

• a substrate having a conductive pattern region and a warpage preventing region defined by the conductive pattern region;
• and
• a warpage preventing pattern disposed on the warpage preventing region, the warpage preventing pattern comprising a first pattern including a first group of warpage preventing members collectively defining a first orientation with respect to the substrate at a first corner of the substrate and a second pattern including a second group of warpage preventing members collectively defining a second orientation with respect to the substrate at a second corner of the substrate, the first corner and the second corner adjacent to each other,
• wherein the first orientation is different from the second orientation, and
• wherein the warpage preventing members of the first and second patterns are disconnected from each other.

A semiconductor package comprising:

• a substrate;
• a conductive pattern region defined in an interior region of the substrate;
• a warpage preventing region defined in corners of the substrate outside of the conductive pattern region;
• a conductive pattern disposed on the conductive pattern region;
• a plurality of bond fingers disposed on the conductive pattern region;
• a plurality of solder ball pads disposed on the conductive pattern region;
• a semiconductor chip disposed on the substrate, the semiconductor chip having a plurality of bond pads disposed thereon, at least one bond pad electrically connected to at least one bond finger;
• and
• a warpage preventing pattern disposed on the warpage preventing region, the warpage preventing pattern comprising:
• a first pattern at a first corner of the substrate and a second pattern at a second corner of the substrate, the first corner and the second corner adjacent to each other, the first pattern and the second pattern disconnected from each other,
• wherein an overall orientation of the first pattern is different from an overall orientation of the second pattern with respect to the substrate.

A method of fabricating a warpage preventing circuit substrate, the method comprising:

• preparing an electrically insulating substrate;
• forming a conductive pattern in a conductive pattern region of the substrate;
• forming a first warpage preventing pattern at a first corner of the substrate;
• and
• forming a second warpage preventing pattern at a second corner of the substrate, the first corner and the second corner adjacent to each other,
• wherein an overall orientation of the first warpage preventing pattern with respect to the substrate is different from an overall orientation of the second warpage preventing pattern with respect to the substrate.