Method and apparatus for directing molding compound flow and resulting semiconductor device packages
AssigneeMicron Technology, Inc.
InventorStephen L. James
Life of this patent
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Abstract
Flow diverting structures for preferentially impeding, redirecting or both impeding and redirecting the flow of flowable encapsulant material, such as molding compound, proximate a selected surface or surfaces of a semiconductor die or dice during encapsulation are disclosed. Flow diverting structures may be included in or associated with one or more portions of a lead frame, such as the paddle, tie bars, or lead fingers. Flow diverting structures may also be inserted into a mold in association with semiconductor dice carried on non-lead frame substrates, such as interposers and circuit boards, to preferentially impede, redirect or both impede and redirect the flow of molding compound flowing between and over the semiconductor dice.
Claims44
A lead frame strip for use in encapsulating a plurality of electronic devices disposed in at least one mold cavity with a flowable molding compound, the lead frame strip comprising:
- a plurality of lead frames, wherein each lead frame of the plurality comprises:
- a plurality of lead fingers located in proximity to an intended location of at least one electronic device when secured to the lead frame;
- at least one member having an enlarged portion proximate the intended location of the at least one electronic device, the enlarged portion positioned and configured with respect to an intended direction of flow of a molding compound past the lead frame during encapsulation thereof to impede flow of the molding compound past at least one surface of the at least one electronic device.
A semiconductor device package comprising:
- at least one semiconductor die;
- a lead frame associated with the at least one semiconductor die, comprising:
- a plurality of lead fingers;
- and
- at least one member proximate the at least one semiconductor die having an enlarged portion having at least a portion thereof configured in a substantially non-parallel orientation relative to a major plane of the at least one semiconductor die;
- and
- a molded dielectric packaging material at least partially encapsulating the lead frame, including the enlarged portion of the at least one member, and at least partially encapsulating the at least one semiconductor die.
A method of packaging at least one semiconductor die, the method comprising:
- flowing an encapsulation compound against at least one semiconductor die and in a direction toward sides thereof substantially parallel to a direction of flow of the encapsulation compound;
- and
- impeding flow of the encapsulation compound around at least one side of the at least one semiconductor die.
A method of packaging a plurality of semiconductor dice, the method comprising:
- attaching an array of semiconductor dice to a substrate;
- attaching a flow diverting structure to the substrate;
- flowing a molding compound across the substrate;
- and
- modifying a flow front of the flowing molding compound to impede flow of the molding compound between laterally separated semiconductor dice of the array and redirect flow of the molding compound over the semiconductor dice.
An assembly for at least partial encapsulation of semiconductor devices, the assembly comprising:
- a substrate bearing a plurality of semiconductor dice in mutually spaced relationship;
- a grid structure associated with the substrate and comprising a plurality of baffles, wherein at least some of the plurality of semiconductor dice are separated by baffles disposed therebetween.
A substrate for the mounting of semiconductor dice thereon, the substrate comprising:
- a planar member;
- a matrix of die attach spots located on a surface of the planar member;
- and
- a matrix of flow restriction structures attached to the planar member, at least some of the flow restriction structure circumscribing at least some of the die attach spots.
Dependencies are inferred from the claim text.