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US 2008/0073757 A1Published application
Semiconductor dies and methods and apparatus to mold lock a semiconductor die
OwnerSteven Alfred Kummerl, Bernhard Peter Lange +1inventors
InventorsSteven Alfred Kummerl, Bernhard Peter Lange, Jeffrey Gail Holloway
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Abstract
Semiconductor dies and methods to mold lock a semiconductor die are disclosed. A disclosed example semiconductor die includes a top surface, a bottom surface, and a plurality of sides joining the top surface and the bottom surface. At least one of the sides includes an interference structure to mold lock the die in a package.
Claims29
A semiconductor die comprising:
- a top surface;
- a bottom surface;
- a plurality of sides joining the top surface and the bottom surface, at least one of the sides comprising an interference structure to mold lock the die in a package.
A method of forming a semiconductor device comprising:
- cutting a wafer to define an interference structure at at least one side of a die;
- and
- separating the die from the wafer.
An exposed die package comprising:
- a die having a side defining an interference structure;
- and
- an encapsulating material at least partially engaging the interference structure to mold lock the die in the package.
Dependencies are inferred from the claim text.