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US 2008/0073756 A1Published application
Module with a shielding and/or heat dissipating element
AssigneeInfineon Technologies AG
InventorsLudwig Heitzer, Christian Stuempfl, Michael Bauer
Life of this patent
Estimating the term…
Abstract
A module (100) comprises a component (10) and a shielding element (11), which is mounted on a main surface (12) of the component (10) and has a welding contact (13).
Claims35
A module comprising
- a first component, and
- a shielding element, which is mounted on a first main surface of the first component and has a welding contact.
A module comprising
- a first component and a second component, which are stacked one on top of the other, and
- a heat dissipating element, which is arranged at least partly between the first and second components and has at least one exposed surface.
A module comprising
- at least one component,
- at least one connecting line, which is connected to the at least one component, and
- a conductive element, which has at least one passage, through which the at least one connecting line is led.
A method, comprising the steps of:
- providing a first component,
- connecting the first component to a shielding and/or heat dissipating element, and
- mounting the first component together with the shielding and/or heat dissipating element on a support.
Dependencies are inferred from the claim text.