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US 2008/0073641 A1Published application
Quantum tunneling devices and circuits with lattice-mismatched semiconductor structures
AssigneeAmberWave Systems Corporation
InventorsZhiyuan Cheng, Calvin Sheen
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Abstract
Structures include a tunneling device disposed over first and second lattice-mismatched semiconductor materials. Process embodiments include forming tunneling devices over lattice-mismatched materials.
Claims25
A structure comprising:
- a non-crystalline material defining an opening having a sidewall disposed above a surface of a substrate, the substrate comprising a first crystalline semiconductor material;
- a second crystalline semiconductor material disposed in the opening, the second crystalline semiconductor material being lattice-mismatched to the first crystalline semiconductor material;
- and
- a tunneling device disposed over at least a portion of the second crystalline semiconductor material.
1 more element
A method for forming a structure, the method comprising:
- forming an opening above a region of a substrate comprising a first crystalline semiconductor material, the opening being defined by a dielectric sidewall and an exposed surface of the substrate;
- forming in the opening a second crystalline semiconductor material lattice-mismatched to the first crystalline semiconductor material;
- and
- defining a tunneling device over at least a portion of the second crystalline semiconductor material.
1 more element
A structure integrating a tunneling diode and a transistor using lattice-mismatched materials, the structure comprising:
- a transistor formed proximate a substrate, the substrate including a first crystalline semiconductor material;
- and
- a tunneling diode coupled to one of a source or a drain of the transistor, the tunneling diode being disposed above a second crystalline semiconductor material lattice-mismatched to the first crystalline semiconductor material,
- wherein at least a portion of the second semiconductor material is disposed within an opening disposed above the substrate, the opening having a non-crystalline sidewall and configured to trap a majority of defects arising from the lattice mismatch between the first and second semiconductor materials.
1 more element
A method of reducing SRAM circuit surface area, the method comprising:
- forming a resonant tunneling diode (RTD)-based static random access memory (SRAM) circuit, the RTD-based SRAM circuit having a perimeter defining an RTD-based SRAM cell area, the cell area including circuit components defining an SRAM memory cell, by:
- forming a transistor having a gate length above a substrate, the substrate including a first crystalline material, and
- forming at least one RTD proximate an opening disposed above the substrate, the opening comprising a non-crystalline sidewall, the RTD being coupled to a source or a drain of the transistor, the RTD including a crystalline material lattice-mismatched to the first crystalline material,
- wherein the RTD-based SRAM cell area is at least 33% smaller than a surface area of an SRAM circuit constructed using six transistors having the same gate length as the transistor in the RTD-based SRAM cell area.
1 more element
A method of forming a transistor structure including a tunneling structure, the method comprising the steps of:
- forming an opening above a surface of a substrate comprising a first crystalline semiconductor material, the opening having a non-crystalline sidewall;
- forming a second crystalline semiconductor material in the opening, the second crystalline semiconductor material being lattice-mismatched to the first crystalline semiconductor material, a majority of defects arising from lattice-mismatch between the first and second semiconductor materials terminating within the opening;
- forming a tunneling structure over and in contact with at least a portion of the second crystalline semiconductor material;
- and
- forming first, second, and third terminals of a transistor proximate the tunneling structure.
2 more elements
Dependencies are inferred from the claim text.