Movable electronic flame-off device for a bonding apparatus

Abstract

A bonding apparatus is provided that comprises a bonding tool for bonding wire onto an electronic device secured by a clamping device. The clamping device is locatable at a first position to clamp the electronic device during bonding and a second position at a raised height to release the electronic device for indexing. A flame-off torch is locatable adjacent to the bonding tool and is operative to produce sparks to melt a tip of the wire for bonding. An actuator is further provided that is operative to lower the flame-off torch close to the electronic device during bonding and to raise the flame-off torch away from the electronic device during indexing so as to provide a height clearance between the flame-off torch and the clamping device at its second position.

Dependencies are inferred from the claim text.