Waste liquid processing method in semiconductor manufacturing process and substrate processing apparatus
OwnerEishi Shiobarainventor
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Abstract
This invention discloses a waste liquid processing method in a semiconductor manufacturing process. The waste liquids of a plurality of chemical solutions are mixed. The mixing ratio of the plurality of solutions in a waste liquid mixture generated by mixing is obtained. It is determined whether the obtained mixing ratio satisfies or is predicted not to satisfy a predetermined condition. If the mixing ratio does not satisfy or is predicted not to satisfy the condition, the waste liquid mixture is diluted with a diluent to satisfy the condition.
Claims20
A waste liquid processing method in a semiconductor manufacturing process, comprising:
- mixing waste liquids of a plurality of chemical solutions used in the semiconductor manufacturing process;
- obtaining a mixing ratio of the plurality of chemical solutions in a waste liquid mixture generated in the mixing waste liquids;
- determining whether the obtained mixing ratio satisfies a predetermined condition or is expected not to satisfy the predetermined condition;
- and
- diluting the waste liquid mixture with a diluent to satisfy the condition if it is determined in the determining that the mixing ratio does not satisfy or is predicted not to satisfy the condition.
A waste liquid processing method in a semiconductor manufacturing process, comprising:
- mixing waste liquids of a plurality of chemical solutions used in the semiconductor manufacturing process;
- obtaining a mixing ratio of the plurality of chemical solutions in a waste liquid mixture generated by the mixing waste liquids;
- determining whether the obtained mixing ratio satisfies a predetermined condition or is expected not to satisfy the predetermined condition;
- and
- controlling a mixing ratio of the waste liquid mixture to satisfy the condition if it is determined in the determining that the mixing ratio does not satisfy or is expected not to satisfy the condition.
A substrate processing apparatus comprising:
- a mixing unit configured to mix waste liquids of a plurality of chemical solutions used in a semiconductor manufacturing process;
- an arithmetic unit configured to obtain a mixing ratio of the plurality of chemical solutions in a waste liquid mixture generated by the mixing unit;
- a determination unit configured to determine whether the mixing ratio obtained by the arithmetic unit satisfies or is predicted not to satisfy a predetermined condition;
- and
- a diluting unit configured to dilute the waste liquid mixture with a diluent to satisfy the condition if the determination unit determines that the mixing ratio does not satisfy or is predicted not to satisfy the condition.
Dependencies are inferred from the claim text.