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US 2008/0073031 A1Published application
Method and apparatus for semiconductor processing
OwnerJ.B. Price, Jed Keller +2inventors
InventorsJ.B. Price, Jed Keller, Laurence Dulmage, David Cheng
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Abstract
A method and apparatus for semiconductor processing is disclosed. In one embodiment, a method of transporting a wafer within a cluster tool, comprises placing the wafer into a first segment of a vacuum enclosure, the vacuum enclosure being attached to a processing chamber and a factory interface. The wafer is transported to a second segment of the vacuum enclosure using a vertical transport mechanism, wherein the second segment is above or below the first segment.
Claims25
A cluster tool, comprising:
- a vacuum enclosure;
- a linear drive to connected to the vacuum enclosure;
- a processing chamber;
- and
- a vertical transport mechanism to transport a wafer between the vacuum enclosure and a second vacuum enclosure.
2 more elements
A cluster tool, comprising:
- a vacuum enclosure;
- a vertical transport mechanism to transport a wafer across a vertical transport path between a first vacuum enclosure and a second vacuum enclosure, the second vacuum enclosure being disposed along the vertical transport path;
- a plurality of processing chambers;
- and
- a plurality of linear drives to transport the wafer between the first vacuum enclosure and the processing chambers.
2 more elements
Dependencies are inferred from the claim text.