Method of supplying liquid bonding material, method of manufacturing electronic circuit board, liquid bonding material supply apparatus and liquid bonding material
AssigneeFUJIFILM Corporation
InventorsJunichi Yoshida, Seiichi Inoue
Life of this patent
Estimating the term…
Abstract
The method of supplying a liquid bonding material includes the steps of: preparing a liquid bonding material containing an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge; and condensing and supplying the liquid bonding material by means of an electrostatic force generated between a supply side and a supply receiving side for the liquid bonding material.
Claims9
A method of supplying a liquid bonding material, comprising the steps of:
- preparing a liquid bonding material containing an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge;
- and
- condensing and supplying the liquid bonding material by means of an electrostatic force generated between a supply side and a supply receiving side for the liquid bonding material.
A method of manufacturing an electronic circuit substrate, comprising the steps of:
- preparing a liquid bonding material containing an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge;
- condensing the liquid bonding material and supplying the liquid bonding material to a supply receiving location of a substrate, by means of an electrostatic force generated between a liquid supply apparatus supplying the liquid bonding material and the supply receiving location of the substrate by the liquid supply apparatus;
- arranging an electrode of an electronic component on the supply receiving location of the substrate;
- and
- causing the insulating resin material and the metal particles of the liquid bonding material supplied to the supply receiving location of the substrate to melt,
- wherein the supply receiving location of the substrate and the electrode of the electronic component are bonded electrically and physically.
A liquid bonding material supply apparatus which supplies a liquid bonding material to a supply receiving body, wherein:
- the liquid bonding material contains an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge;
- and
- the liquid bonding material is condensed and supplied to the supply receiving body by means of an electrostatic force generated between the liquid bonding material supply apparatus and the supply receiving body.
A liquid bonding material which is condensed and supplied to a supply receiving side by means of an electrostatic force generated between a supply side and the supply receiving side, the liquid bonding material containing an insulating solvent and charged particles dispersed in the insulating solvent, the charged particles being constituted by metal particles and an insulating resin material that coats the metal particles and takes charge.
Dependencies are inferred from the claim text.