Laminated circuit board and its manufacturing method, and manufacturing method for module using the laminated circuit board and its manufacturing apparatus

A manufacturing method for a module formed by separating sub-substrate from main substrate having a plurality of sub-substrates connected to each other, comprising the steps of laminating a substrate on which a land disposed on one main surface thereof is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on the upper surface of the substrate and provided with a filling portion by fluid resin at the outer periphery of the electronic component;

• thermo-compression bonding for integrating the first sheet and the substrate by thermal compression to form a laminated circuit board after the laminating step;
• component mounting for mounting components on one surface of the laminated circuit board after the thermo-compression bonding step;
• cover setting for setting a cover on the sub-substrate so as to cover the mounted components after the component mounting step;
• sheet affixing for affixing an adhesive sheet to the upper side of the cover to form a sheet part after the cover setting step;
• dividing for electrically Isolating the laminated circuit boards from each other and also dividing into sub-substrates mechanically connected by the adhesive sheet after the sheet affixing step;
• inspection for inspecting the sub-substrates after the dividing step;
• and peeling for removing the sub-substrate from the sheet after the inspection step, wherein the first sheet uses woven or non-woven cloth which is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component and a plate having resin soaked into the woven or non-woven cloth, and the resin used is resin having heat fluidity.

A manufacturing method for a module formed by separating sub-substrate from main substrate having a plurality of sub-substrates connected to each other, comprising the steps of laminating a substrate on which a land disposed on one main surface thereof. Is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on one main surface of the substrate and provided with a filling portion by fluid resin at the outer periphery of the electronic component;

• thermo-compression bonding for integrating the first sheet and the substrate by thermal compression to form a laminated circuit board;
• component mounting for mounting components on one surface of the laminated circuit board;
• cover setting for setting a cover on the sub-substrate so as to cover the mounted components;
• sheet affixing for affixing an adhesive sheet to the upper side of the cover to form a sheet part;
• dividing for electrically isolating the laminated circuit boards from each other and also dividing into sub-substrates mechanically connected by the adhesive sheet;
• laser trimming for adjusting coil inductor by laser trimming from the opposite surface of the component mounted surface of the laminated circuit board;
• inspection for inspecting the sub-substrate;
• and peeling for removing the sub-substrates from the sheet, wherein the first sheet uses plate-like woven or non-woven cloth impregnated with resin having heat fluidity which is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component.

A module manufacturing device for manufacturing a module formed from main substrate having a plurality of sub-substrates connected to each other, comprising a laminated circuit board manufacturing device for manufacturing a laminated circuit board as the main substrate;

• a component mounting device for mounting components on one surface of the laminated circuit board;
• a cover setting device, disposed in the downstream from the component mounting device, for setting a cover on each of the sub-substrates so as to cover the component mounted by the component mounting device;
• a sheet affixing device, disposed in the downstream from the cover setting device, for affixing an adhesive sheet to the cover side;
• a dividing device, disposed in the downstream from the sheet affixing device, for dividing the sub-substrates;
• an inspecting device disposed in the downstream from the dividing device;
• and a peeling device, disposed in the downstream from the inspecting device, for removing the adhesive sheet, wherein the laminated circuit board manufacturing device has a substrate on which a land disposed on the upper surface thereof is connected and fixed to an electrode of electronic component by using a connecting and fixing material, and a first sheet laminated on the upper surface of the substrate and provided with a filling portion by fluid resin at an outer periphery of the electronic component, and the first sheet is provided with opening having clearance against the outer periphery of the electronic component at a portion corresponding to the electronic component and is formed from woven or non-woven cloth impregnated with resin having heat fluidity, and the first sheet and the substrate are integrated by thermo-compression bonding.