Adhesive tape cutting method and adhesive tape joining apparatus using the same
AssigneeNitto Denko Corporation
InventorsMasayuki Yamamoto, Saburo Miyamoto
Life of this patent
Estimating the term…
Abstract
In a state that a reference plane of a cutter holder, to which a cutter blade is attached, is brought into contact with a surface of a base of a supporting adhesive tape, the cutter blade cuts the supporting adhesive tape while the reference plane of the cutter holder follows the surface of the base. Herein, a cutting edge of the cutter blade passes by a joining interface between the supporting adhesive tape and a ring frame without penetrating through an adhesive layer of the supporting adhesive tape.
Claims13
A method for cutting a supporting adhesive tape through which a ring frame holds a semiconductor wafer, the method comprising the step of:
- cutting an adhesive tape along a contour of a ring frame while maintaining constant a distance from a reference plane of a cutter holder, which is an attachment base end of a cutter blade, to a portion to be cut of the adhesive tape joined to the ring frame.
A method for cutting a supporting adhesive tape through which a ring frame holds a semiconductor wafer, the method comprising the step of:
- measuring a thickness of an adhesive tape on a cutting pathway of a cutter blade, and cutting the adhesive tape while adjusting a position of a cutting edge of the cutter blade in accordance with a result of the measurement.
An apparatus for joining a semiconductor wafer to a ring frame through a supporting adhesive tape such that the ring frame holds the semiconductor wafer, the apparatus comprising:
- wafer holding means for holding a semiconductor wafer;
- frame holding means for holding a ring frame so as to be opposite to the semiconductor wafer held by the wafer holding means;
- tape supply means for supplying a strip-shaped supporting adhesive tape toward the ring frame;
- joining means allowing a joining member to move while being pressed against a non-adhesive surface of the adhesive tape, for joining the semiconductor wafer to the ring frame such that the ring frame holds the semiconductor wafer;
- a cutting mechanism for cutting the adhesive tape along a contour of the ring frame while allowing a reference plane of a cutter holder, which is a cutter blade attachment base end, to follow the surface of the adhesive tape joined to the ring frame;
- and
- removal means for removing the unnecessary portion of the adhesive tape from the ring frame.
An apparatus for joining a semiconductor wafer to a ring frame through a supporting adhesive tape such that the ring frame holds the semiconductor wafer, the apparatus comprising:
- wafer holding means for holding a semiconductor wafer;
- frame holding means for holding a ring frame so as to be opposite to the semiconductor wafer held by the wafer holding means;
- tape supply means for supplying a strip-shaped supporting adhesive tape toward the ring frame;
- joining means allowing a joining member to move while being pressed against a non-adhesive surface of the adhesive tape, for joining the semiconductor wafer to the ring frame such that the ring frame holds the semiconductor wafer;
- a cutting mechanism allowing the ring frame and a cutter blade to relatively move along a contour of the ring frame, for cutting the adhesive tape;
- measurement means for measuring a thickness of the adhesive tape on a cutting pathway of the cutter blade when the cutting mechanism cuts the adhesive tape;
- control means for controlling a position of a cutting edge in accordance with the measured thickness of the adhesive tape;
- and
- removal means for removing the unnecessary portion of the adhesive tape from the ring frame.
Dependencies are inferred from the claim text.