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US 2007/0222010 A1Published application
Semiconductor integrated circuit chip with a nano-structure-surface passivation film and method of fabricating the same
AssigneeLightuning Tech. Inc.
InventorsBruce C.S. Chou, Chen-Chih Fan
Life of this patent
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Abstract
A semiconductor integrated circuit (IC) chip includes an IC chip body and a nano-structure-surface passivation film. The IC chip body has at least one surface. The nano-structure-surface passivation film is formed on the at least one surface. The nano-structure-surface passivation film including nano-particles and a carrier resin protects the IC chip body from encountering any external interference.
Claims10
A semiconductor integrated circuit chip, comprising:
- an integrated circuit (IC) chip body having at least one surface;
- and
- a nano-structure-surface passivation film, which has a lotus effect and is formed on the at least one surface, for protecting the IC chip body from encountering any external interference.
Dependencies are inferred from the claim text.