US 2007/0214925 A1 · SUBSTRATE DICING SYSTEM, SUBSTRATE MANUFACTURING APPARATUS, AND SUBSTRATE DICING METHOD

Abstract

The objective of the present invention is to make an entire system compact and provide a substrate cutting system capable of efficiently cutting a variety of substrates. A substrate cutting system according to the present invention includes: pair of scribing line forming means arranged facing each other; pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction; a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction; and a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.

Claims59

Dependent claims

A substrate cutting system, comprising:

a pair of scribing line forming means arranged facing each other;
a pair of scribing devices for supporting the pair of scribing forming line means such that one of the pair of scribing forming line means moves on a first surface of a substrate in an X axial direction and the other of the pair of scribing forming means moves on a second surface of the substrate in the X axial direction;
a scribing device guide body for supporting the pair of scribing devices such that the pair of scribing devices moves in a Y axial direction;
and
a substrate supporting means for supporting the substrate in an X-Y plane such that the pair of scribing forming line means scribes the first surface of the substrate and the second surface of the substrate.

2 more elements

A method for cutting a plurality of unit substrates from a mother substrate, the method comprising:

a forming step of forming scribing lines on a first surface of the mother substrate and a second surface of the mother substrate by a pair of scribing line forming means,
the forming step includes the step of forming, on the mother substrate, a first scribing line for cutting a first unit substrate from the mother substrate and a second scribing line for cutting a second unit substrate from the mother substrate by moving the pressure onto the mother substrate by each of the pair of scribing line forming means such that the pressure onto the mother substrate is not interrupted.

Dependencies are inferred from the claim text.

Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method

Life of this patent

Substrate dicing system, substrate manufacturing apparatus, and substrate dicing method

Life of this patent

Abstract

Claims59