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OwnerHatsuo Ishida, Koichi Shibayama +1inventors
InventorsHatsuo Ishida, Koichi Shibayama, Hiroshi Abe
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The invention provides a thermosetting resin composition comprising a bifunctional dihydrobenzoxazine compound and an epoxy compound, and provides a thermosetting resin molding obtained by thermally curing the thermosetting resin composition. The molding has excellent electric properties of low dielectric constant and low dielectric loss tangent. The resin composition comprises an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20): wherein R represents a linear alkylene group having at least 2 carbon atoms, or a branched alkylene group derived from it by substituting the hydrogen atom therein with an alkyl group, and the hydrogen atom of the benzene ring may be substituted with an alkyl group or an alkoxy group.
A thermosetting resin composition comprising an epoxy compound and a bifunctional dihydrobenzoxazine compound of the following general formula (1), wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20):
A thermosetting resin composition comprising an epoxy compound, a bifunctional dihydrobenzoxazine compound of the following general formula (1) and a curing agent for epoxy compound, wherein the equivalent ratio of epoxy compound/bifunctional dihydrobenzoxazine compound/curing agent for epoxy compound is 1/(0.1 to 20)/(0 to 1.2):
A thermo setting resin composition comprising an epoxy compound, a bifunctional dihydrobenzoxazine compound of the following general formula (1) and an inorganic filler, wherein the equivalent ratio of the epoxy compound to the bifunctional dihydrobenzoxazine compound is 1/(0.1 to 20), and the amount of the inorganic filler is at most 400 parts by weight relative to 100 parts by weight of the total of the epoxy compound and the bifunctional dihydrobenzoxazine compound:
A thermosetting resin composition comprising an epoxy compound, a bifunctional dihydrobenzoxazine compound of the following general formula (1), a curing agent for epoxy compound and an inorganic filler, wherein the equivalent ratio of epoxy compound/bifunctional dihydrobenzoxazine compound/curing agent for epoxy compound is 1/(0.1 to 20)/(0 to 1.2), and the amount of the inorganic filler is at most 400 parts by weight relative to 100 parts by weight of the total of the epoxy compound, the bifunctional dihydrobenzoxazine compound and the curing agent for epoxy resin:
Dependencies are inferred from the claim text.