Silicone adhesion modulator system and use thereof for the preparation of curable anti-adhesive compositions

A curable anti-adhesive composition containing:

• at least one linear polydiorganosiloxane (D) blocked by terminal triorganosiloxane groups, said organic radicals being C1-C18 alkyl or cycloalkyl groups, C2-C20, preferably C2-C12, alkenyl, (C3-C9)alkenyloxy(C2-C4)alkylene, at least 80 mol % of said radicals being a methyl group, at least 0.1 mol %, preferably from 0.5 to 5 mol % of said organic radicals being identical or different alkenyl or alkenyloxyalkylene groups directly bonded to silicon (“Si alkenyl”);
• at least one modulator system based on the constituents (A), (B) and (C) as defined above;
• at least one hydrosilylation inhibiting agent;
• at least one linear polyorganohydrogensiloxane crosslinking agent (E) containing from 1.6 to 0.5 mol % of hydrogen atoms directly bonded to silicon (“SiH”) as chain end(s) and/or within the chain, the identical or different organic radicals being C1-C18 alkyl groups, at least 80 mol % of said organic radicals being methyl groups, the quantity of crosslinking agent being such that the (number of moles of “SiH” deriving from the nonreactive resin (B), from the “reactive” solvent (C) and from the crosslinking agent (E))/(number of moles of “Si alkenyl” deriving from the reactive resin (B), from the “reactive” solvent (C) and from the linear blocked polydiorganosiloxane (D)) ratio is greater than 1, preferably of the order of 1.1 to 2.5;
• an effective quantity of a hydrosilylation catalyst.