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OwnerTsuneki Wakita, Keiji Nakamura +4inventors
InventorsTsuneki Wakita, Keiji Nakamura, Hideaki Makino, Masahiro Osuka, Yohei Miwa, Yasutaka Doi
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A modifier for resin has an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes. Also a resin composition comprises 1 to 40% by mass of the modifier for resin and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin, and a molded article is produced by molding the same.
A modifier for resin having an average particle size of 20 μm or more, wherein particles having an average particle size of 10 μm or less account for less than 30% by mass of the modifier, and particles having an average particle size of 10 μm or less account for 30% by mass or more of the modifier after irradiating the modifier with ultrasonic wave of 40 W for 5 minutes.
A resin composition comprising 1 to 40% by mass of the modifier for resin according to claim 1 and 99 to 60% by mass (the total amount of both components is 100% by mass) of a thermoplastic resin or a curable resin.
Dependencies are inferred from the claim text.