US 2007/0191540 A1 · LOW DIELECTRIC LOSS RESIN, RESIN COMPOSITION, AND THE MANUFACTURING METHOD OF LOW DIELECTRIC LOSS RESIN

Abstract

An object of the present invention is to provide a low dielectric loss resin composition with a narrow molecular weight distribution, the resin composition suffering as low a dielectric loss as that of commercially available polyphenylenether, being soluble in a general-purpose solvent with a low boiling point, and being easily processed into a wiring board. The present invention provides a thermosetting low dielectric loss resin which is a random copolymer of polyphenylenether having an unsaturated bond in a side chain and which has a molecular weight distribution of less than 10, more preferably at most 5, particularly preferably at most 3, as well as the hardened resin, a resin composition and an electronic part containing the resin, and a synthesizing method for obtaining the resin.

Claims22

Dependent claims

A thermosetting low dielectric loss resin which is a random copolymer consisting of repeating units expressed by the following Formula:

where X denotes a repeating unit expressed by Formula 2, R1 and R2 denote hydrocarbon groups with a carbon number of 1, R3 denotes a functional group containing an unsaturated hydrocarbon with a carbon number of 2 to 9, R4 denotes a functional group containing at least one of a saturated hydrocarbon, an unsaturated hydrocarbon, and an aromatic hydrocarbon, and m and n denote integers of at least 2 which indicate the degrees of polymerization, wherein the copolymer has a molecular weight distribution of less than 10.

Dependencies are inferred from the claim text.

Low dielectric loss resin, resin composition, and the manufacturing method of low dielectric loss resin

Life of this patent

Low dielectric loss resin, resin composition, and the manufacturing method of low dielectric loss resin

Life of this patent

Abstract

Claims22