Rf module and manufacturing the same

A semiconductor device comprising:

• (a) a first semiconductor chip having two or more first pads;
• (b) a second semiconductor chip having two or more second pads;
• (c) a wiring board on which said first semiconductor chip and said second semiconductor chip are mounted;
• and
• (d) two or more wires directly connecting said first pads with said second pads,
• wherein either said two or more first pads or said two or more second pads are rectangular.

A method of manufacturing a semiconductor device, comprising the steps of:

• (a) arranging, adjacent to each other, a first semiconductor chip in which an amplifier circuit amplifying an input signal and generating an output signal is formed and a second semiconductor chip in which a control circuit for controlling said amplifier circuit is formed;
• and
• (b) directly connecting two or more first pads formed over said first semiconductor chip with two or more second pads formed over said second semiconductor chip by wires,
• wherein connection by said wires is made from said two or more second pads to said two or more first pads in step (b)