Three-dimensional network for chemical mechanical polishing
AssigneeRohm and Haas Electronic Materials CMP Holdings, Inc.
InventorGregory P. Muldowney
Life of this patent
Estimating the term…
Abstract
The polishing pad (104) is useful for polishing at least one of magnetic, optical and semiconductor substrates (112) in the presence of a polishing medium (120). The polishing pad (104) includes a three-dimensional network of interconnected unit cells (225). The interconnected unit cells (225) are reticulated for allowing fluid flow and removal of polishing debris. A plurality of polishing elements (208) form the three-dimensional network of interconnected unit cells (225). The polishing elements (208) have a mean height (214) to a mean width (222) ratio of at least 3. The polishing surface (200) formed from the plurality of polishing elements (208) remains consistent for multiple polishing operations.
Claims10
A polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium, the polishing pad comprising:
- a) a three-dimensional network of interconnected unit cells, the interconnected unit cells being reticulated or having an open cell structure for allowing fluid flow and removal of polishing debris;
- b) a plurality of polishing elements forming the three-dimensional network of interconnected unit cells, the polishing elements having a mean height to a mean width ratio of at least 3 for allowing the polishing medium to flow through the plurality of polishing elements of the interconnected unit cells;
- c) a polishing surface formed from the plurality polishing elements, the polishing surface having a surface area measured in a plane parallel to the polishing surface that remains consistent for multiple polishing operations.
A polishing pad useful for polishing at least one of a magnetic, optical and semiconductor substrate in the presence of a polishing medium, the polishing pad comprising:
- a) a three-dimensional network of interconnected unit cells, the interconnected unit cells having a mean length and a mean width with the mean length and the mean width being unequal and the interconnected unit cells being reticulated or open-cell structure for allowing fluid flow and removal of polishing debris;
- b) a plurality of polishing elements forming the three-dimensional network of interconnected unit cells, the polishing elements having a mean height to a mean width ratio of at least 5 for allowing the polishing medium to flow through the plurality of polishing elements of the interconnected unit cells;
- c) a polishing surface formed from the plurality polishing elements, the polishing surface having a surface area measured in a plane parallel to the polishing surface that remains consistent for multiple polishing operations.
A method of polishing at least one of a magnetic, optical and semiconductor substrate with a polishing pad in the presence of a polishing medium, comprising the steps of:
- creating dynamic contact between the polishing pad and the substrate to polish the substrate, the polishing pad comprising:
- a three-dimensional network of interconnected unit cells, the interconnected unit cells being reticulated or open-cell structure for allowing fluid flow and removal of polishing debris;
- a plurality of polishing elements forming the three-dimensional network of interconnected unit cells, the polishing elements having a mean height to a mean width ratio of at least 3for allowing the polishing medium to flow through the plurality of polishing elements of the interconnected unit cells;
- a polishing surface formed from the plurality polishing elements, the polishing surface having a surface area measured in a plane parallel to the polishing surface that remains consistent for multiple polishing operations;
- and
- removing polishing debris through openings between the polishing elements.
Dependencies are inferred from the claim text.